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We are pleased to announce that our company introduction, which was interviewed by Mr. Onishi, Managing Director of Grand Joint Technology appeared in “Electronics Packaging Technology” 2022 VOL 38 2 published on Jan 20, 2022.

Since its first issue in 1985, “Electronics Packaging Technology” has been Japan’s only magazine specializing in packaging technology, providing the latest information on electronic circuit design and manufacturing technology, materials, and manufacturing equipment, as well as company trends. It highlights cutting-edge technologies, events, and corporate trends in Japan and abroad, and provides valuable information to a wide range of key persons involved in the electronics industry.